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Thermal Simulation Software


Software Cradle Co., Ltd.
CONTACT: Sales
PHONE: +81.3.5435.5641
FAX: +81.3.5435.5645
E-MAIL: picls@cradle.co.jp
www.cradle-cfd.com
ADDRESS: Tokyo Office
1-11-1, Osaki, Shinagawa-ku
Tokyo 141-0032 Japan
Additional office in Nagoya Japan
CATEGORIES: Thermal Simulation Software
The thermal simulation tool for printed circuit boards - Generates results real-time through easy and quick operation in 2D.
PICLS is a thermal simulation tool specially designed for thermal simulation of PCBs. PCB modeling can be done easily through simple and quick operation in 2D like E-CAD using layers and PCB manipulating tool. You can import E-CAD data to perform thermal analyses from day one.


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